Product Description:
In today's rapidly developing modern technology, the performance of electronic devices is constantly improving. Along with this comes a large amount of heat generated during the operation of the devices. How to achieve efficient heat dissipation has become a key factor in ensuring the stable operation of devices and extending their service life. Our ceramic heat sinks, with their excellent performance and unique design, have become the ideal choice for solving heat dissipation problems.
I. Exceptional Material for Worry - Free Heat Dissipation
- High Thermal Conductivity: This ceramic heat sink is made of advanced ceramic materials, and its thermal conductivity far exceeds that of traditional metal heat sinks. With efficient heat conduction performance, it can quickly transfer the heat generated inside the device, ensuring that the device always operates at an appropriate temperature.
- Good Thermal Stability: Ceramic materials have excellent thermal stability and can still maintain stable heat dissipation performance in high - temperature environments. Whether in the hot summer or when the device is running under high load for a long time, the ceramic heat sink can reliably play its role in heat dissipation and ensure the normal operation of the device.
- Excellent Insulation Performance: Different from metal heat sinks, ceramic heat sinks have excellent insulation performance. This characteristic can effectively avoid the risk of short - circuit caused by the heat sink when used in electronic devices, improving the safety and reliability of the device.
II. Exquisite Design for Outstanding Performance
- Optimized Heat Dissipation Structure: The carefully designed heat sink structure greatly increases the heat dissipation area. The unique fin design can make full use of the principle of air convection to accelerate the dissipation of heat and further improve the heat dissipation efficiency.
- Lightweight and Robust: While ensuring excellent heat dissipation performance, the ceramic heat sink is relatively light in weight, reducing the overall burden on the device. At the same time, the high strength of ceramic materials gives it good impact - resistance and vibration - resistance, adapting to various complex usage environments.
- Convenient Installation: The product design fully considers the convenience of installation and is equipped with simple and easy - to - use installation accessories. Whether in the device manufacturing process or during later maintenance and replacement, the installation can be easily completed, saving time and labor costs.
III. Wide Applications to Meet Diverse Needs
- Electronic Device Field: It is suitable for CPU and GPU radiators of computers, effectively reducing the chip temperature, improving computer performance, and reducing lag. In mobile devices such as mobile phones and tablets, the ceramic heat sink can help the processor dissipate heat quickly, ensuring the smooth operation of the device during long - term use and avoiding the problem of frequency reduction caused by overheating.
- Industrial Control Field: Industrial automation equipment, servers, etc. have extremely high requirements for heat dissipation. The ceramic heat sink can provide reliable heat dissipation guarantee for these devices, ensuring the stable operation of the devices in harsh industrial environments, reducing the probability of failures, and improving production efficiency.
- Communication Equipment Field: Communication equipment such as 5G base stations and routers generate a large amount of heat during operation. The efficient heat dissipation performance of the ceramic heat sink can meet the strict heat dissipation requirements of these devices, ensuring the stable transmission of signals and improving communication quality.
Choosing our ceramic heat sink means choosing an efficient and reliable heat dissipation solution for your device. We are committed to providing customers with high - quality products and professional services, helping your technology products to achieve the best performance under the guarantee of efficient heat dissipation.
Features:
- Product Name: Ceramic Heat Sink
- Temperature Resistance: ＜700℃
- Surface Roughness: 0.3-0.8 Um
- Density: 3.7g/cm^3
- Material: Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
- Mechanical Strength: ≥3000MPa
- Low cost
- Not affected by humidity and dust
- No antennae effect
Technical Parameters:
| Surface Roughness |
0.3-0.8 Um |
| Insulation Strength |
>=15KV/mm |
| Durability |
Long-lasting |
| Material |
Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃ |
| Density |
3.7g/cm³ |
| Thermal Conductivity |
9-180 MW/m.K |
| Color |
Green, Black, White, Gray |
| Mechanical Strength |
>=3000MPa |
| Heat Dissipation |
Efficient |
| Size |
Various Sizes Available |
| Adhesive Tape |
With and without thermally conductive Silicone adhesive tape |
| EMI Issues |
No Electromagnetic Interference (EMI) issues |
| Antennae Effect |
No antennae effect |
Applications:
The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink has a large surface area compared to Aluminium Heat Sinks, resulting in better heat dissipation. Its lightweight design makes it easy to install and handle. With a temperature resistance of less than 700℃ and a density of 3.7g/cm^3, this product is ideal for applications that require high-temperature resistance and high-density power.
This product can be used with various electronic devices such as Transistors, MOSFETs, Schottky Diodes, IGBTs, high-density switching power supplies, high-frequency communication signal equipment, high-frequency welding machines, and other electronic devices. Its power dissipation of up to 10W makes it suitable for high-performance applications.
At Race, we offer packaging options as per customer requirements and a delivery time of 7-15 days. Payment terms are 30% TT in advance, and the balance payment is paid before shipment. The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink is available in green, black, white, and gray colors, giving our customers the opportunity to choose the color that best suits their device.
